Concept Flow
Layer Transition Strategy Flow: [Top Layer] --via--> [Inner1 Layer] --via--> [Inner2 Layer] --via--> [Bottom Layer] Via Types: - Through Via: connects Top to Bottom - Blind Via: connects Top to Inner1 or Inner1 to Inner2 or Inner2 to Bottom Costs: Through Via = 5 Blind Via = 3
This flow shows how signals move through PCB layers using different via types. Through vias connect the top and bottom layers directly, while blind vias connect intermediate layers. Each via type has an associated manufacturing cost.
